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(Product features):
Brominated epoxy resin was
introduced into the molecular structure of bisphenol A epoxy resin to make its
curing components have excellent flame retardant and mold resistance. The
higher the bromine content is, the better the flame retardant performance will
be. So brominated epoxy resin is widely used in the fields of electronics,
electrical appliances, shipping, civil engineering and so on.
A80
was FR CYDB - 450-4 copper clad dedicated brominated flame retardant resin, the
resin has high purity, high reactivity, good stability and strong specificity,
cured with good flame retardancy, heat resistance and excellent electrical
properties, chemical resistance, excellent adhesion characteristics, especially
suitable for with dicyandiamide and imidazole Li curing agent, FR - 4 copper
clad.
PRODUCT TECHNICAL SPECIFICATION
NO. |
The name of a product |
Epoxy equivalent (g/mol) |
Hydrolyzed chlorine %(Mass fraction) ≤ |
Softening point (ºC) |
Volatile component, %(Mass fraction) ≤ |
Solution viscosity(mPa.s 25ºC) |
Bromine content, %(Mass fraction) ≤ |
Chroma ≤ |
Main application |
|
1 |
CYDB-500 |
450-500 |
0.10 |
65-80 |
0.3 |
-- |
19-22 |
1 |
Pouring |
|
2 |
CYDB-700 |
680-730 |
0.10 |
85-100 |
0.3 |
-- |
23-25 |
1 |
Powder coating |
|
3 |
CYDB-900 |
850-950 |
0.10 |
90-100 |
0.3 |
-- |
26-29 |
1 |
Laminate |
|
4 |
CYDB-400 |
380-420 |
0.11 |
64-74 |
0.3 |
-- |
46-50 |
5 |
|
|
5 |
CYDB-450A80 |
420-460 |
0.05 |
-- |
19-21 |
1000-2000 |
19-21 |
0.3 |
Copper clad plate |
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